The IC packaging is all about encasing the semiconductor die and taking out macroscopic electrical contacts for interconnections on a PCB. Low Profile Quad Flat Pack (LQFP) is a surface-mount IC package with leads extending from all around four sides of the package body. Like Liked Unlike. The classification of IC packages by different vendors, suppliers, and manufacturers are done in different schemes. Secondly, it protects the circuit from corrosion. Body Size Range: 5 mm x 5 mm to 20 mm x 20 mm, Available Lead Pitches: 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm, 1.0 mm. Well, this happens due to temperature variation within your reflow oven. If you encounter a QFN defect post assembly, you can rework on that particular component by removing and replacing it. However, the TQFP has shorter leads than the LQFP. Package is finished with a nickel plus a thick gold layer, except where the leads are soldered and decoupling capacitors are soldered on top of the package. The aperture-pad ratio should also be 0.8:1 or within that range for optimum results. In commercial circuits, the preferred mounting is always SMT except for few situations where through-hole is still the ideal choice. The pinout can be linear, in two parallel directions, all four sides, or matrix form. To accomplish this you must replace a couple of pins, often those found in the central part of the opposing side, with pins that are thicker. Also, make sure the bond pad design lies at a range of 0.2 0.3 away from your package footprint. The QFP means (quad flat pack). Quad Flat Pack (QFP) 102 total package options for the Texas Instruments Quad Flat Pack (QFP). So now let us look at QFP and then, later on, compare the two. If you have any questions, you can feel free to contact me! QFPs are surface mounted and can be thermally enhanced through an exposed pad. Ceramic Flat Pack These IC packages have a smaller pitch (50 mils) and were designed for US military standardized PCBs. Why? Some manufacturers do not give package information in every datasheet but instead have a catalogue of land patterns in a different document. In through-hole packages, the IC leads are designed to be inserted through holes on the PCB before soldering. Why are physically impossible and logically impossible concepts considered separate in terms of probability? This page was last edited on 17 February 2023, at 08:18. At present, it is only used by some analog ICs. We shall also answer questions such as if the two have any significant differences, which of the two should you consider for your project? See QFP, PQFP, CQFP and TQFP. These packages utilize ceramic which improves their quality and also their efficiency. A QFP is a surface-mounted IC (integrated circuit) package having gull-wing like leads extending on either side of their four edges. Why do small African island nations perform better than African continental nations, considering democracy and human development? Thermal & mechanical simulation results were performed to prove its advantage over conventional LQFP and LQFP_EP. The common surface-mount small-outline packages are SOP (Small Outline Package), CSOP (Ceramic small-outline package), DSOP (Dual small-outline package), HSOP (Thermally-enhanced small-outline package), SSOP (Shrink Small Outline Package), TSOP (Thin-Small Outline Package), TSSOP (Thin-Shrink Small Outline Package), TVSOP (Thin very-small-outline package), MSOP (Mini/Micro Small Outline Package), HSSOP (Thermally-enhanced shrink small-outline package), HTSSOP (Thermally-enhanced thin shrink small-outline package), QSOP (Quarter Small Outline Package), SOIC (Small Outline Integrated Circuit), mini-SOIC (Mini small-outline integrated circuit), SOICW (Small Outline Integrated Circuit Wide), PSOP (Plastic small-outline package), PSON (Plastic small-outline no-lead package), VSOP (Very-small-outline package), VSSOP (Very-thin shrink small-outline package), SOJ (Small Outline J-leaded package), SON (Small Outline Non-leaded package), VSON (Very-thin Small Outline Non-leaded package), WSON (Very-very-thin small-outline no-lead package), and USON (Very-very-thin small-outline no-lead package). Integrated Circuits rule the world of electronics. Quad Flat J-leaded package QFP . For example, for semiconductor components with heat sinks, inductors, and transformers, through-hole mounting is ideal. SMT allows automated placement of more components in a smaller area. Quarter-size small-outline package (QSOP): with pin spacing of 0.635mm. All sorts of circuits analog, digital and mixed-signal, and all types of components passive or active can be integrated into an IC. 505 Xinhua Road Xinhua District, Shijiazhuang Hebei China. Use MathJax to format equations. Mercury (Hg): 0.1% (1000ppm), 3. A split light system To observe the bottom portion of the QFN package plus the site on the print circuit board. Hi, I am Hommer Zhao, the founder of WellPCB. These features make them suitable for higher frequency applications. Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a, Chip-on-glass (COG), a variation of COB, where a chip, typically a. Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. The extensions shield the leads against any mechanical damage before you solder this package onto a PCB. 144-pin low profile quad flat package (LQFP), 80-pin thin quad flat package (TQFP) PIC microcontroller, 304-pin plastic quad flat package (QFP) with exposed thermal pad (TP), 100-pin bumpered quad flat package (BQFP) Cyrix Cx486SLC, 80-pin ceramic quad flat package (TQFP) ST6 microcontroller. LGA (Land Grid Array) parts are similar to BGAs except that they do not have solder balls as leads but flat surface with pads. Whats even worse is that this problem seems to affect two major areas: Therefore, when dealing with stencil designs, you must have accurate stencil thickness and aperture design. The most common pin counts are four, six, eight, fourteen, eighteen, twenty, twenty-eight, and forty pins. They hence become less robust whenever they experience some nominal CM or OEM practices. There's a standard IPC-7351A which describes method to design land patters. Since then, there have been several updates to the Directive, the major ones being 2011/65/EU on 8 June 2011 that recasted exemptions expiring in 2011 to future dates (most in 2016). LQFP can have higher lead counts, and its leads are longer. Some QFP packages have an exposed pad. Rectangular the number of pins that come out of each side is different due to varying lengths. Though surface-mount technology succeeded plated through-hole (PTH), through-hole is still used in commercial circuits wherever surface-mount is not suitable. Splaying IC pins out in all four directions gets you something that might look like a quad flat package (QFP). How Intuit democratizes AI development across teams through reusability. Packaging terminology Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI's packaging options. LQFPs have an exposed die pad on the bottom of the package, which is created by an appropriate lead frame down-set. TQFP vs. LQFP: The Major Difference Thin Quad Flat Package (TQFP) is often compared to the Low-profile Quad Flat Package (LQFP) because they both belong to the broader Quad Flat Package (QFP). Note that excessive soldering paste causes solder bridging. Instead of a tree-structured classification generally used by suppliers and manufacturers, we are listing the major IC package types. By definition, a QFP with 256 pins means that it would typically have around sixty-four pins protruding on either side of the package. First off, let us look at the QFN packaging, and then we shall move on to the QFP later on. But do the two function in a similar manner? They can have different pin pitch (the distance between pins) and perhaps even a different package size. The drawing below show the package structure difference between a punched and sawn QFN. A very large number of different types of package exist. TI offers 256-pin CQFP packages where decoupling capacitors can be soldered on top of the package[5] E.g. Packages with exposed pads should not be placed opposite to each other on either side of a PCB when doing double-sided mounting. They connect to these components using wires connected to the chips terminal. Flip-chip is less expensive molded QFN package that utilizes flip-chip interconnectivity onto copper lead frame. The quad flat package (QFP) is basically an integrated circuit package which is surface-mounted and pins on them are spaced anywhere from .4mm-1mm apart. Body sizes range from 77 mm to 28 x28 mm. These solder balls melt during soldering and make the connection between the PCB and component. A QFP IC can have pins anywhere from eight per side (32 total) to upwards of seventy (300+). Well, here is how. QFNs can also only have multiple or single pin rows, not both. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing. This IC has two parallel rows of pins extending perpendicularly out of a rectangular plastic housing. SMD devices such as rectangular transistors are available in SOT packages. 06_00 | Nov 12, 2020 | PDF | 1.44 mb . Commonly used for rectifier, Schottky, and other diodes. STM32F103 microcontrollers use the Cortex-M3 core, with a maximum CPU speed of 72 MHz. Connect and share knowledge within a single location that is structured and easy to search. This is a different technology referred to as Surface-Mount Technology (SMT). Typically 1.4 mm thick. Circuit Board Fabrication and PCB Assembly Turnkey Services WellPCB - Circuit Board Fabrication and PCB Assembly Turnkey Services, 3rd Floor, Nanhai Plaza, NO. However, QFPs are often square, and the pin count mostly lies at around 256 or more. [1] The later pin grid array (PGA) and ball grid array (BGA) packages, by allowing connections to be made over the area of the package and not just around the edges, allowed for higher pin counts with similar package sizes, and reduced the problems with close lead spacing. The third way the IC packages can be further classified is their terminal (pin) shape. Enough to scare off, all those fancy terms DIP, SIP, SOP, SSOP, TSOP, MSOP, QSOP, SOIC, QFP, TQFP, BGA, etc., are all names different IC packages. The pins just touch the PCB making the soldering process pretty easy. Socketing of these packages is rare and through-hole mounting is not possible. They are used for mainstream cost sensitive applications. On this Wikipedia the language links are at the top of the page across from the article title. E.g. Does ZnSO4 + H2 at high pressure reverses to Zn + H2SO4? In print circuit board QFP assembly, you can utilize a force convection oven for reflow soldering. What am I doing wrong here in the PlotLegends specification? Mutually exclusive execution using std::atomic? Is it using the same landpad as for QFP (reflow soldering)? It is an SMD with all DIP pins bent outwards and shrunk down to size. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. The packaging mainly serves three purposes first, it protects the semiconductor circuit from physical impairment or damage. 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You can therefore do the direct soldering of the packet onto your PCB when you wish to gain optimum transfer of heat from your die. PLCC is QFJ of plastic, and the . Stack Exchange network consists of 181 Q&A communities including Stack Overflow, the largest, most trusted online community for developers to learn, share their knowledge, and build their careers. In most cases, they share the same moisture level (JEDEC Level 3). Very-small Quad Flat Package MQFP. . Day Job: Mostly LEDs. Do you work with programmable modules, PCBs, or microcomputers? Thank you, I'm aware of the different pitch variations. MC9S08AW60CPUE vs MC9S08AW60MPUE Compare result: MC9S08AW60CPUE ,MC9S08AW60MPUE . LQFP package having total height less than 1.7mm (including 1.7mm) and more than 1.2mm (no including 1.2mm), said package named Low profile Quad Flat Package. These packages have two rows of pins and have a through-hole mounting style. Your happiness as a customer is my priority! Why is there a voltage on my HDMI and coaxial cables? Generally, large-scale or very large-scale integrated circuits use this In the form of packaging, the number . However, when they encounter a low-volume, high-mix situation, things tend to become a little messy. These QFPs utilize pin protectors positioned at the devices corners. Pages: [ 1] Go Up. Regular QFPs may display up to 4.0 mm of thickness. As stated above, QFPs come in many different variations, which include: These QFPs have extensions on each of their four corners. The packaging of an integrated circuit is as important as the integrated circuit, the semiconductor device within. This will stiffen the assembly and cause solder joints to fatigue earlier than in a design in which the components are offset. 4. To increase the number of pins, the spacing was decreased from 50 mil (as found on small outline packages) to 20 and later 12 (1.27mm, 0.51mm and 0.30mm respectively). Because of their small size and heat-dissipating characteristics, QFN IC packages are widely used. LQFP (Low Profile Quad Flat Package) LQFP is a kind of QFP whose package body thickness is 1.4 mm and this is the name used by the Japanese Electronics and Machinery Industry according to the new QFP shape specification. The Thin Quad Flat Pack, or TQFP, is a surface-mount IC package with gull wing leads on all four sides of the package body. How to show that an expression of a finite type must be one of the finitely many possible values? "QFP" redirects here. It is better to design own land pattern based on your design requirements.